TSMC has announced that its advanced packaging capacity is fully booked for the next two years by NVIDIA and AMD
TSMC, the world’s leading semiconductor manufacturer, has announced that its advanced packaging capacity is fully booked for the next two years. This development comes astasks. TSMC anticipates a significant surge in revenue from AI processors, with projections indicating a doubling this year alone. Over the next five years, the compound annual growth rate for AI chips is expected to hit 50%, with AI processors projected to contribute over 20% of TSMC’s revenue by 2028.
Guanghuida, a rising player in the AI chip market, has also booked TSMC’s packaging capacity. Their H100 chips, powered by TSMC’s 4nm process and CoWoS packaging, boast SK Hynix’s HBM for enhanced performance. Moreover, Guanghuida’s latest Blackwell architecture AI chip, based on TSMC’s advanced 4nm process, features upgraded HBM3e memory, doubling computing power compared to its predecessors.
The soaring demand for AI chips is fueled by global cloud service giants such as Amazon AWS, Microsoft, Google, and Meta, all vying for superiority in the AI server domain. With shortages from major manufacturers like Nvidia, AMD, and Guanghuida, these cloud behemoths are turning to TSMC to fulfill their orders, contributing to the chipmaker’s optimistic revenue projections.is ramping up its production capacity for advanced packaging.
TSMC’s fully booked advanced packaging capacity signifies the accelerating pace of innovation in AI-driven computing, with key players strategically positioning themselves to capitalize on this potential market.© 2024 Gizmochina | All rights reserved | If you buy something via one of our affiliate links, Gizmochina may earn a commission.
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