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has reportedly secured four major clients for its latest SoIC packaging – AMD, Nvidia, Broadcom, and Apple. The chip manufacturer is actively working on increasing its next-generation chip packaging production capacity.Apple will reportedly use SoIC with Hybrid molding . The company is currently conducting a small-scale trial production and will reportedly start mass production in 2025.
TSMC’s SoIC is the industry’s first high-density 3D chip stacking technology which enables heterogenous integration of chips with different sizes using Chip-on-Wafer packaging. This innovative packaging method was first introduced in 2018. Reportedly, the planned advanced packaging facility in Chiayi, Taiwan will not only include two CoWoS plants but also an SoIC facility.is TSMC’s first customer to adopt SoIC technology.
As per Mark Gurman, Apple has officially commenced the development of the M4 chip, which will likely debut with the next-generation MacBook Pro. As TrendForce noted, there’s a possibility that Apple will switch to a 2nm process node for the M4 chip. Regarding the release of the next Apple Silicon, we can see nearly a one and a half year gap between each of the previous iterations. The Apple M1 was released back in November 2020, the M2 was released in June 2022, and the M3 chip was released towards the end of October last year. So we can expect Apple to release the M4 chip in the first half of next year.
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