Solid-state cooling will continue to grow in importance as more mobile devices use hotter processors. xMEMS has a novel MEMS-based product to address this challenge.
As the solid-state cooling space continues to heat up—pun intended—new companies are entering the market to help cool things down. xMEMS is a company that has been around since 2018 and has been disrupting the audio market with its micro speaker and active acoustic vent technologies. However, the company has discovered that this same IP can be used to help cool microchips with a solid-state solution that uses piezo actuators.
The xMEMS solution, which the company itself directly compares to Frore Systems’ offering, is a considerably smaller solution than Frore’s original AirJet product. The xMEMS solution is 9.3mm x 7.3mm x 1mm, while the AirJet Mini Slim is 27.5mm x 41mm x 2.8mm. Based on these dimensions and cooling performance, xMEMS says its product is 16x more efficient in airflow per volume while using one-tenth of the power.
That said, it would be wise to integrate this functionality somewhere else, like on the SoC, to make system design less complex. On the plus side, the xMEMS cooling solution is IP58 certified, so it can still cool a device without compromising water resistance. The company is dual-sourcing its manufacturing at TSMC and Bosch to ensure that it has enough capacity to meet potential customer demand.
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