Intel has announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued scaling of transistors in a package and advance Moore’s Law to deliver data centric applications. “After a decade of research, Intel has achieved industry-leading glass substrates […]
Intel has announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued scaling of transistors in a package and advance Moore’s Law to deliver data centric applications.
Intel is on track to deliver complete glass substrate solutions to the market in the second half of this decade, allowing the industry to continue advancing Moore’s Law beyond 2030. Chip architects will have the ability to pack more tiles – also called chiplets – in a smaller footprint on one package, while achieving performance and density gains with greater flexibility and lower overall cost and power usage.
As a result of these distinctive properties, a 10-times increase in interconnect density is possible on glass substrates. Further, improved mechanical properties of glass enable ultra-large form-factor packages with very high assembly yields.
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